INLINE SYSTEM FOR MANUFACTURING SEMICONDUCTOR PACKAGE
PROBLEM TO BE SOLVED: To provide an inline system for manufacturing a semiconductor package utilizing application of a liquid adhesive onto a wafer back face. SOLUTION: The inline system for manufacturing a semiconductor package is provided with a loading section 12 for loading a wafer; a back lap s...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide an inline system for manufacturing a semiconductor package utilizing application of a liquid adhesive onto a wafer back face. SOLUTION: The inline system for manufacturing a semiconductor package is provided with a loading section 12 for loading a wafer; a back lap section 14 for lapping the back face of the wafer transported from the loading section 12; a washing section 16 which is provided with an atmospheric-pressure plasma generating device and washes the wafer in completing lapping at the back lap section 14 using the atmospheric-pressure plasma; an application section 18 for applying a liquid adhesive to the back face of the wafer in completing washing by the washing section 16 to form an adhesion layer; an adhering section 24 for adhering a dicing tape onto an adhesion layer formed on a wafer; an unloading section 26 for unloading the wafer having the adhesion layer formed on; and a transporting means 28 for transporting in sequence the wafer to the loading section 12, the back lap section 14, the washing section 16, the application section 18, the adhering section 24 and the unloading section 26. COPYRIGHT: (C)2008,JPO&INPIT |
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