LITHOGRAPHY EQUIPMENT AND METHOD

PROBLEM TO BE SOLVED: To provide a method by which a portion with no resist around an outside region of a substrate is provided in the shape of a continuous ring. SOLUTION: Ultraviolet rays radiant port UVS irradiates a region of a resist 1 already exposed by i-line ultraviolet radiation, and also a...

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Bibliographische Detailangaben
Hauptverfasser:	GUI CHENG-QUN, PELLENS RUDY JAN MARIA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method by which a portion with no resist around an outside region of a substrate is provided in the shape of a continuous ring. SOLUTION: Ultraviolet rays radiant port UVS irradiates a region of a resist 1 already exposed by i-line ultraviolet radiation, and also a portion of a resist R surrounding the region 1 which was irradiated before. The resist R is irradiated by deep ultraviolet radiant rays, by which a layer 3 is formed. This layer 3 is a polymerized layer formed by cross-linking between other processes. An ICA in the resist R forms ester with a Novolak structure. A remained PAC polymer forms bonding with the Novolak structure (for example, a vulcanization process is caused). The polymerized layer 3 is not dissolved in MIB developer or MIF developer. Moreover, the polymerized layer 3 becomes insensitive to ultraviolet rays. COPYRIGHT: (C)2008,JPO&INPIT