SUBSTRATE HAVING BUILT-IN ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF SAME

PROBLEM TO BE SOLVED: To provide a substrate having a built-in electronic component in which the plane dimension (plane area) and height can be remarkably reduced, and to provide a manufacturing method of the substrate having the built-in electronic component. SOLUTION: The substrate 100 having the built-in electronic component has a configuration in which an electronic component 30 is disposed between at least two substrates 10, 20, at least one side of the substrate 10 is electrically connected to an electrode 34 of the electronic component 30, the substrates 10, 20 are electrically connected to each other and a part between the substrates 10, 20 is sealed with a resin. In the substrate, solder balls 40 for electrically connecting the substrates 10, 20 are disposed on a surface facing the other substrate 20 of the electronic component 30. COPYRIGHT: (C)2008,JPO&INPIT