SEALING RESIN COMPOSITION AND RESIN-SEALED TYPE SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a resin composition excellent in crack resistance under a high temperature and humidity resistant reliability on sealing a surface-mounting type semiconductor device, and without substantially containing a bromine based flame retardant and an antimony compound. SOLUT...

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Bibliographische Detailangaben
Hauptverfasser:	SUDO NOBUHIRO, WADA YUZURU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin composition excellent in crack resistance under a high temperature and humidity resistant reliability on sealing a surface-mounting type semiconductor device, and without substantially containing a bromine based flame retardant and an antimony compound. SOLUTION: This resin composition is provided by containing a prescribed epoxy resin, a phenol resin-curing agent, a curing accelerator, silica as an inorganic filler and a coupling agent as essential components, having an excellent flame retardant property without substantially using the bromine-based flame retardant and antimony compound, and enabling to bear reflow at a high temperature. The resin-sealed type semiconductor device sealed by the above resin is also provided. COPYRIGHT: (C)2008,JPO&INPIT