DRY WASHING METHOD AND APPARATUS FOR LAMINATED CERAMIC ELECTRONIC COMPONENT CHIP

PROBLEM TO BE SOLVED: To surely and easily remove polishing materials and polishing waste from the surface of a laminated ceramic electronic component chip. SOLUTION: In a dry washing method and apparatus for a laminated ceramic electronic component chip, soft media are added to a mixture of laminat...

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Hauptverfasser: MINAMI ISAMU, KUBO HIROYA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To surely and easily remove polishing materials and polishing waste from the surface of a laminated ceramic electronic component chip. SOLUTION: In a dry washing method and apparatus for a laminated ceramic electronic component chip, soft media are added to a mixture of laminated ceramic electronic component chips, polishing materials and polishing waste after a dry polishing process, and the mixture is agitated to remove the polishing materials and polishing waste from the laminated ceramic electronic component chips by the soft media. COPYRIGHT: (C)2008,JPO&INPIT