ELECTRONIC COMPONENT MOUNTING APPARATUS

PROBLEM TO BE SOLVED: To mixedly package a bare IC component and a surface mounting component, while ensuring degree of cleanliness of mounting environment, without causing increase in the facility cost. SOLUTION: In the electronic component packaging apparatus, a closed space is formed in which an inverted transport means 25, a board positioning means 29 and a packaging means 26 are disposed, and a cover 36 having an opening for carrying in and out a board 31 is provided. The cover 36 has an upper surface center part, provided with a cleaned air inlet means 38 for introducing cleaned air into the closed space; furthermore, a shutter 41 is provided at the opening of the cover 36 for carrying in and carrying out the board; the shutter 41 is opened, when the board is carrying in or out and is closed when a packaging operation is performed; a ventilation duct 39 is provided, for discharging the dust of the closed space of the cover 36 and air, on the rear surface of the cover 36 on one side of a surface packaging component feed means 19 provided facing a bare IC component feed means on a side of the positioning means. COPYRIGHT: (C)2008,JPO&INPIT