MANUFACTURING METHOD OF WIRING CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide the manufacturing method of a wiring circuit board capable of efficiently destacisizing the charging of static electricity of the wiring circuit board obtained, while preventing discoloration of a terminal unit. SOLUTION: A suspension substrate 1 with circuit, which...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ISHII ATSUSHI, KURAI HIROYUKI, OYABU KYOYA
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide the manufacturing method of a wiring circuit board capable of efficiently destacisizing the charging of static electricity of the wiring circuit board obtained, while preventing discoloration of a terminal unit. SOLUTION: A suspension substrate 1 with circuit, which is equipped with a metal support substrate 2, a base insulating layer 3, a conductor pattern 4 and a cover insulating layer 5, is prepared; and subsequently, a protective layer 9, formed of lead and/or tin whose reference electrode potential is lower than that of copper forming the conductor pattern 4, is laminated on an exposed unit 11, exposed from the opening 12 of the cover-insulating layer 5. Thereafter, the suspension substrate 1 with a circuit, on which the protective layer 9 is laminated, is dipped into superimposed liquid of polyaniline, to form a half-conductive layer 10 on the surface of the base insulating layer 3 and the surface of the cover insulating layer 5. COPYRIGHT: (C)2008,JPO&INPIT