MANUFACTURING METHOD OF CERAMIC MULTILAYER SUBSTRATE

PROBLEM TO BE SOLVED: To provide a manufacturing method of a ceramic substrate capable of reducing chipping of child substrates when dividing the ceramic substrate by dicing. SOLUTION: The manufacturing method of a ceramic multilayer substrate includes a process for preparing a ceramic green sheet,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ISHIKAWA TORU, SHIGEMI ATSUSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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