MANUFACTURING METHOD OF CERAMIC MULTILAYER SUBSTRATE

PROBLEM TO BE SOLVED: To provide a manufacturing method of a ceramic substrate capable of reducing chipping of child substrates when dividing the ceramic substrate by dicing. SOLUTION: The manufacturing method of a ceramic multilayer substrate includes a process for preparing a ceramic green sheet, a process for forming a via hole in which a conductive paste is injected and for forming a plurality of holes on a dicing division line for dividing the ceramic green sheet, a process for forming a via by injecting conductive paste into the via hole, a process for forming a specified conductor pattern on the ceramic green sheet using the conductive paste, a process for forming a laminate by stacking a plurality of ceramic green sheets, a process for baking the laminate to obtain a ceramic multilayer substrate assembly, and a process for dividing the ceramic multilayer substrate assembly into a plurality of ceramic multilayer substrates by dicing. COPYRIGHT: (C)2008,JPO&INPIT