MULTI-LAYER WIRING PLATE MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a multi-layer wiring plate manufacturing method which can deposit electrolytic metal plating on the outmost conductor layer in an uniform thickness even if conventionally manufacturing a multi-layer wiring plate of a structure which needs to supply a current from the back to a deposited conductor on the surface, or, supply a current from the surface to the deposited conductor on the back, where the plating deposit conductor and a current supplying portion are not the same conductor layer when conducting the electrolytic metal plating in a multi-layer wiring plate manufacturing method having a process of conducting electrolytic metal plating on the outmost conductor layer of a multi-layer wiring plate. SOLUTION: After forming the outmost conductor layer, an inter layer connection portion electrically connecting the outmost conductor layers of surface/back are formed in a non-productive area before the process of conducting the electrolytic metal plating. COPYRIGHT: (C)2008,JPO&INPIT