SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To prevent poor connection due to displacement of a semiconductor element during flip-chip connection of the semiconductor element having a miniaturized and narrow-pitch bump, and ensure reliability of the device. SOLUTION: A guide that is formed of an insulative resin and aims...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IKEDA HIROAKI, NAKA YASUHIRO, NISHI KUNIHIKO, TENMYO HIROYUKI, ISHINO MASAKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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