SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To prevent poor connection due to displacement of a semiconductor element during flip-chip connection of the semiconductor element having a miniaturized and narrow-pitch bump, and ensure reliability of the device. SOLUTION: A guide that is formed of an insulative resin and aims...

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Bibliographische Detailangaben
Hauptverfasser:	IKEDA HIROAKI, NAKA YASUHIRO, NISHI KUNIHIKO, TENMYO HIROYUKI, ISHINO MASAKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent poor connection due to displacement of a semiconductor element during flip-chip connection of the semiconductor element having a miniaturized and narrow-pitch bump, and ensure reliability of the device. SOLUTION: A guide that is formed of an insulative resin and aims for the prevention of displacement is provided around a connecting electrode. Assuming that an angle of inclination of a side of a connection of the guide is θ when a positioning error of a semiconductor device connecting device is δ, the insulative resin has a thickness of δ tan θ or more. COPYRIGHT: (C)2008,JPO&INPIT