ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING THE STRUCTURE

PROBLEM TO BE SOLVED: To provide a highly reliable electronic component mounting structure for enabling connection in the narrower pitch under lower pressure via a flexible and fine protruded electrode and for preventing damage of the component due to stress during the pressurized contact thereof. SOLUTION: The electronic component mounting structure 1 includes an electronic component 10, provided with a plurality of electrode terminals 10a and a mounting substrate 12, providing a connecting terminal 12a at a location facing the electrode terminal 10a and connects the electrode terminal 10a and the connecting terminal 12a via a protruded electrode 13, provided on the electrode terminal 10a or on the connecting terminal 12a. The protruding electrode 13 is provided with at least a conductive filler 13a and a photosensitive resin 13b and is such that the crosslink density of resin element of the photosensitive resin 13b is different in the direction of the height of the protruded electrode 13. COPYRIGHT: (C)2008,JPO&INPIT