INDUCTOR, HIGH-FREQUENCY DEVICE USING THE INDUCTOR, AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To solve the problem wherein a high-frequency device cannot be thinned easily since an inductor coil is high. SOLUTION: There are provided: a substrate 21; connection terminals 25a, 25b provided on the substrate 21; and an inductor conductor 22 attached onto the substrate 21 fo...

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Bibliographische Detailangaben
Hauptverfasser: ASAKAWA YASUTERU, KIMURA JUNICHI, FUKUSHIMA SUSUMU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To solve the problem wherein a high-frequency device cannot be thinned easily since an inductor coil is high. SOLUTION: There are provided: a substrate 21; connection terminals 25a, 25b provided on the substrate 21; and an inductor conductor 22 attached onto the substrate 21 for connecting the connection terminals 25a, 25b. The inductor conductor 22 is connected to the connection terminals 25a, 25b by solder 32, thus forming the inductor by attaching the inductor conductor onto the substrate, and hence thinning the high-frequency device. COPYRIGHT: (C)2008,JPO&INPIT