SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFORE

PROBLEM TO BE SOLVED: To decrease the number of wires and lengths of the wires to achieve bonding reliability. SOLUTION: The semiconductor device has a first wire loop in which one free-standing end is ball-bonded to a first bonding point and the other free-standing end is ball-bonded to a second bo...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAGAE YOSHIHARU, HAYASHI TADAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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