SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFORE

SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFORE

PROBLEM TO BE SOLVED: To decrease the number of wires and lengths of the wires to achieve bonding reliability. SOLUTION: The semiconductor device has a first wire loop in which one free-standing end is ball-bonded to a first bonding point and the other free-standing end is ball-bonded to a second bo...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: NAGAE YOSHIHARU, HAYASHI TADAO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To decrease the number of wires and lengths of the wires to achieve bonding reliability. SOLUTION: The semiconductor device has a first wire loop in which one free-standing end is ball-bonded to a first bonding point and the other free-standing end is ball-bonded to a second bonding point, wherein the top surface of the first wire loop's ball part is in a crushed state at its top including part of the wire, and it has a second wire loop that provides a bridge between the ball part's top surface and a third bonding point. COPYRIGHT: (C)2008,JPO&INPIT