ULTRASONIC BONDING DEVICE

PROBLEM TO BE SOLVED: To provide an ultrasonic bonding device which is equipped with a cooling means to reduce the amount of heat conducted from a heater to a vibrator, while avoiding adversely affecting the vibration that propagates to a horn. SOLUTION: An ultrasonic bonding device 1 is equipped wi...

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Bibliographische Detailangaben
Hauptverfasser:	NEHASHI TORU, HERAI MASAYASU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER DYNAMO-ELECTRIC MACHINES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FOR PERFORMING MECHANICAL WORK IN GENERAL GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL GENERATION MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an ultrasonic bonding device which is equipped with a cooling means to reduce the amount of heat conducted from a heater to a vibrator, while avoiding adversely affecting the vibration that propagates to a horn. SOLUTION: An ultrasonic bonding device 1 is equipped with a cooling pipe 3 which serves as a cooling means between heaters 13A, 13B and a vibrator 9 of an ultrasonic mounting tool 60. COPYRIGHT: (C)2008,JPO&INPIT