HEAT RADIATING FIN OF SEMICONDUCTOR ELEMENT, HEAT RADIATOR, AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a heat radiator which is small in the number of component parts, simple in configuration, and capable of being manufactured at a low cost and to provide its manufacturing method. SOLUTION: The heat radiator 1A is mainly composed of a support board 10 and a heat radia...

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1. Verfasser: MIYAMOTO MITSUYA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a heat radiator which is small in the number of component parts, simple in configuration, and capable of being manufactured at a low cost and to provide its manufacturing method. SOLUTION: The heat radiator 1A is mainly composed of a support board 10 and a heat radiating fin 20 installed upright on the support board 10. The support board 10 is provided with two or more fixing grooves 13A, which are each wide and deep as prescribed, on its upper surface 11 for fixing the heat radiating fin 20. The heat radiating fin 20 is composed of a first heat radiating unit 21, a fin fixing unit 23 extending continuously from the first heat radiating unit 21, and a second heat radiating unit 22 extending continuously from the fin fixing unit 23. The manufacturing method of the heat radiator of this invention comprises a board manufacturing step S1, a fin forming step S2, and a fixing step S3. COPYRIGHT: (C)2008,JPO&INPIT