SENSOR APPARATUS

PROBLEM TO BE SOLVED: To provide a semiconductor sensor capable of detecting the movement of a target to be detected that uses a simpler constitution, without requiring special semiconductor processes. SOLUTION: A sensor apparatus 1 has a diaphragm 10, elastically deforming by a deformation volume,...

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Bibliographische Detailangaben
1. Verfasser:	SUZUI KEISUKE
Format:	Patent
Sprache:	eng
Schlagworte:	ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PHYSICS SEMICONDUCTOR DEVICES TARIFF METERING APPARATUS TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor sensor capable of detecting the movement of a target to be detected that uses a simpler constitution, without requiring special semiconductor processes. SOLUTION: A sensor apparatus 1 has a diaphragm 10, elastically deforming by a deformation volume, according to the intensity of working external force and a pedestal 20 for elastically deformably supporting the diaphragm 10, and has, at the rear of the diaphragm 10 (more accurately, a deforming part 10b), a piezoelectric element 30 as a means for detecting the deformation volume of the deforming part 10b, at a position where the thickness increases rapidly. It further has a magnet 40, formed into an appropriate shape and of a material, substantially at the center at the rear of the deforming part 10b of the diaphragm 10. The rotation of a gear, rotating with rotation of a rotary shaft (not shown), is detected via a microcomputer (detecting means) 50, based on the output voltage from the piezoelectric element 30, and the pressure of the atmosphere surrounding the sensor apparatus 1 is also detected. COPYRIGHT: (C)2008,JPO&INPIT