PIE PRODUCT FOR REHEATING WITH MICROWAVE OVEN AND PACKAGE THEREOF

PROBLEM TO BE SOLVED: To obtain a pie product for reheating by microwave oven, which is warmed simply and quickly in a microwave oven and has its pie surface identical in crispiness texture to that which has been freshly baked in oven, and to provide its package. SOLUTION: The pie product for reheat...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MIYAZAKI YUSUKE, OBAYASHI TOMOKAZU, HOSAWA KYO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To obtain a pie product for reheating by microwave oven, which is warmed simply and quickly in a microwave oven and has its pie surface identical in crispiness texture to that which has been freshly baked in oven, and to provide its package. SOLUTION: The pie product for reheating in microwave oven is such that wheat flour with amylose elution ratio of 30% or lower is contained in pie dough and that the product is wrapped in a microwave oven heating element; the pie product for reheating by a microwave oven contains wheat flour having amylose elution ratio of 30% or lower at a ratio of 20-30 mass%, with respect to the total grain flour used in the pie dough; the package body of the pie product for reheating by microwave oven is obtained, by packaging the pie product having wheat flour that has amylose elution ratio of 30% or lower as the raw material with a heating body in microwave oven; and the package body of the pie product for reheating by microwave oven is a pie product that has wheat flour as the raw material, having amylose elution ratio of 30% or lower and at a ratio of 20-30 mass% with respect to the total grain flour used in the pie dough. COPYRIGHT: (C)2008,JPO&INPIT