WAFER HOLDER AND WAFER PROBER INSTALLED WITH THE SAME

PROBLEM TO BE SOLVED: To provide a wafer holder that can improve positional accuracy and temperature uniformity to be improved and the chip to be heated and cooled rapidly by reducing deformation even if a high load is applied thereto, and improving the heat insulation effect, and to provide a wafer...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ITAKURA KATSUHIRO, NISHI TERUHITO, AWAZU TOMOYUKI, NAKADA HIROHIKO, NATSUHARA MASUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a wafer holder that can improve positional accuracy and temperature uniformity to be improved and the chip to be heated and cooled rapidly by reducing deformation even if a high load is applied thereto, and improving the heat insulation effect, and to provide a wafer prober device installed with the wafer holder. SOLUTION: The wafer holder consists of a chuck top having a chuck top conductor layer on its surface, and a supporter for supporting the chuck top, and has a support member, in a gap between the chuck top and the supporter of which the shape comprises only of the shape of a pipe. The support member is preferably arranged coaxially, with respect to the supporter or arranged substantially at the center of the supporter, and is preferably provided with both the support member arranged coaxially and with the support member arranged substantially at the center. COPYRIGHT: (C)2008,JPO&INPIT