POWER MODULE

PROBLEM TO BE SOLVED: To improve a power device which accepts the power module, to the extent that the power module can be simply installed in the power device as one assembly. SOLUTION: The power module to be assembled on a printed circuit board (46) includes a housing (214) for assembling a circui...

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1. Verfasser:	EHLER RALF
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve a power device which accepts the power module, to the extent that the power module can be simply installed in the power device as one assembly. SOLUTION: The power module to be assembled on a printed circuit board (46) includes a housing (214) for assembling a circuit carrier (212) and a cooling element. The circuit carrier (212) is arranged on the printed circuit board in such a way that the circuit carrier (212) becomes nearly orthogonal to the printed circuit board when the power module is assembled on it. The power module has at least one plug portion (220) for attaching the power module to the printed circuit board, in order to improve the power device which accepts the power module so as to simplify the assembly of the power module in the power device. COPYRIGHT: (C)2008,JPO&INPIT