SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device of which the heat radiation is compatible with heat cycle reliability. SOLUTION: The semiconductor device comprises a lead frame 1, a disc 2 which is jointed to one surface of the lead frame, and a semiconductor chip 3 jointed to one surface of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: NAKAYOSHI HIDEO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a semiconductor device of which the heat radiation is compatible with heat cycle reliability. SOLUTION: The semiconductor device comprises a lead frame 1, a disc 2 which is jointed to one surface of the lead frame, and a semiconductor chip 3 jointed to one surface of the disc. The disc has a three-layer clad layer constitution of copper, iron, and copper. COPYRIGHT: (C)2008,JPO&INPIT