HEAT SINK

PROBLEM TO BE SOLVED: To provide a heat sink that has a passive function for heat dissipation and an active function such as temperature adjustment by a thermostat. SOLUTION: The heat sinks 11-1 to 11-3 are provided with heat-sink main bodies that have spiral structures each formed of a first member...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SAKAKI NAOYA, AOKI YASUNORI, SAKURADA MITSUTOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a heat sink that has a passive function for heat dissipation and an active function such as temperature adjustment by a thermostat. SOLUTION: The heat sinks 11-1 to 11-3 are provided with heat-sink main bodies that have spiral structures each formed of a first member formed of a shape memory alloy and a second member for heat dissipation, a detection part that detects that a part of the spiral structure is touched with the detection part itself, and a signal sending part that, when the spiral structure is transformed according to a temperature rise and a part thereof is brought into contact with the detection part, sends a specified signal using the detected result as a trigger. COPYRIGHT: (C)2008,JPO&INPIT