EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE

PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is free from the occurrence of peeling or cracking after a reflow process in a packaging process and to provide an electronic component device provided with an elemental component sealed by the epoxy resin composition. SOLUTION: The e...

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Hauptverfasser:	NARA NAOKI, TAKEMIYA KEIZO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is free from the occurrence of peeling or cracking after a reflow process in a packaging process and to provide an electronic component device provided with an elemental component sealed by the epoxy resin composition. SOLUTION: The epoxy resin composition for sealing a plated lead frame package contains (A) an epoxy resin and (B) a curing agent wherein (B) the cuing agent contains a curing agent represented by general formula (I) and a curing agent represented by general formula (II). In the formula (I), n represents an integer of 0-10 and in the formula (II), n represents an integer of 0-14. COPYRIGHT: (C)2008,JPO&INPIT