SUPPORTING METHOD AND SUPPORTING STRUCTURE OF SUBSTRATE

SUPPORTING METHOD AND SUPPORTING STRUCTURE OF SUBSTRATE

PROBLEM TO BE SOLVED: To provide a supporting method and a supporting structure of a substrate in which high-precision positioning is ensured by reducing warpage of a glass substrate when the periphery of the glass substrate is supported from below. SOLUTION: One supporting pin 4a is arranged on eac...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAWANO MASAKI, OIZUMI MITSUNORI, HORIE SHIGENARI, TSUMOTO YOSHIKIMI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a supporting method and a supporting structure of a substrate in which high-precision positioning is ensured by reducing warpage of a glass substrate when the periphery of the glass substrate is supported from below. SOLUTION: One supporting pin 4a is arranged on each short side 3a of a rectangular glass substrate 3 while two supporting pins 4b are arranged on each long side 3b of the rectangular glass substrate 3. The supporting structure is constituted by using in total six supporting pins 4a and 4b and arranging the support pins 4a and 4b on the periphery of the glass substrate 3 while avoiding four corners thereof thus supporting the glass substrate 3 from below. COPYRIGHT: (C)2008,JPO&INPIT