LOW THERMAL-CONDUCTIVE FRAME MEMBER

LOW THERMAL-CONDUCTIVE FRAME MEMBER

PROBLEM TO BE SOLVED: To provide a steel frame member which is prevented from degradation of mechanical characteristics thereof and improved in thermal resistance thereof, by adequately arranging holes in a web portion. SOLUTION: The frame member is formed of a shape steel having flange portions and...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KUBO TATSUHIRO, MITSUI YUKIE
Format: Patent
Sprache:eng
Schlagworte:
BUILDING
BUILDING MATERIALS
CEILINGS
FIXED CONSTRUCTIONS
FLOORS
GENERAL BUILDING CONSTRUCTIONS
INSULATION OR OTHER PROTECTION OF BUILDINGS
ROOFS
STRUCTURAL ELEMENTS
WALLS, e.g. PARTITIONS
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a steel frame member which is prevented from degradation of mechanical characteristics thereof and improved in thermal resistance thereof, by adequately arranging holes in a web portion. SOLUTION: The frame member is formed of a shape steel having flange portions and the web portion, wherein the web portion has formed therein a number of discontinuous slots in n rows. Provided that the length of each slot is set to L, a hole-to-hole distance to a, and a constant to α, respectively, a thermal path difference X is represented by X=(n-α)(L-a)/2, and the slot is formed so as to satisfy the following relationship: 15 mm≤X≤150 mm, where L≤100 mm, α=0.25 when n