METHOD OF SURFACE MODIFICATION TREATMENT, MANUFACTURING PROCESS OF SUBSTRATE FOR CONNECTING ELECTRODE AND SEMICONDUCTOR

PROBLEM TO BE SOLVED: To provide a method of surface modification treatment which renders an excellent adhesion between a heat-resistant resin and an adhesive or an adhesive film even after a high temperature high pressure treatment, a substrate for connecting an electrode and a manufacturing proces...

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1. Verfasser: KANETANI YUICHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method of surface modification treatment which renders an excellent adhesion between a heat-resistant resin and an adhesive or an adhesive film even after a high temperature high pressure treatment, a substrate for connecting an electrode and a manufacturing process of a semiconductor. SOLUTION: The method of the surface modification treatment comprises coating a surface modification treatment liquid on the heat-resistant resin layer formed on a substrate and drying the coated surface modification treatment liquid. The surface modification treatment liquid contains at least one kind of surface modification agent selected from the group consisting of aluminum chelate compounds, titanium chelate compounds, zirconium chelate compounds, aluminum alcolates, titanium alcolates and zirconium alcolates and a solvent. COPYRIGHT: (C)2008,JPO&INPIT