CUTTER AND CUTTING MACHINE EQUIPPED WITH CUTTER

PROBLEM TO BE SOLVED: To provide a cutter which enhances heat radiation properties while suppressing increase in the thickness and weight of a substrate to improve cutting capability and durability. SOLUTION: In the cutter 1 having cutting parts (a plurality of chips 3) in an outer peripheral part o...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SATO ITSUO, KATO KIYOSHI, SASAKI YASUO, KAMIMURA JUNICHI, UNNO MAYUMI
Format:	Patent
Sprache:	eng
Schlagworte:	GRINDING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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