CUTTER AND CUTTING MACHINE EQUIPPED WITH CUTTER

PROBLEM TO BE SOLVED: To provide a cutter which enhances heat radiation properties while suppressing increase in the thickness and weight of a substrate to improve cutting capability and durability. SOLUTION: In the cutter 1 having cutting parts (a plurality of chips 3) in an outer peripheral part o...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SATO ITSUO, KATO KIYOSHI, SASAKI YASUO, KAMIMURA JUNICHI, UNNO MAYUMI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a cutter which enhances heat radiation properties while suppressing increase in the thickness and weight of a substrate to improve cutting capability and durability. SOLUTION: In the cutter 1 having cutting parts (a plurality of chips 3) in an outer peripheral part of the disc-like substrate 2, a plurality of recessed parts 6 are formed on the substrate 2 and are arranged in the radial direction by using the center of the substrate 2 as a starting point. Here, the recessed parts 6 are regularly arranged on the substrate 2. The recessed parts 6 are formed on both faces of the substrate 2 and are arranged by shifting them regularly for each other on both faces of the substrate 2. In addition, the recessed part 6 has a semi-spherical shape and is also formed in a joint part (a joint layer 5) with the chip 3 in the outer periphery of the substrate 2. COPYRIGHT: (C)2008,JPO&INPIT