MULTILAYER WIRING BOARD

MULTILAYER WIRING BOARD

PROBLEM TO BE SOLVED: To provide a multilayer wiring board having high degree of freedom in designing, excellent bondability, and satisfactory production efficiency. SOLUTION: The board 100a includes multilayer resin layers 110a each having a first layer 111 which includes thermoplastic resin, a sec...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HIRANO SATOSHI, SHIMOGAMI KOICHIRO, HIGO ICHIEI, KIMURA YUKIHIRO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a multilayer wiring board having high degree of freedom in designing, excellent bondability, and satisfactory production efficiency. SOLUTION: The board 100a includes multilayer resin layers 110a each having a first layer 111 which includes thermoplastic resin, a second layer 112 which includes thermosetting resin, and piercing conductors 113, and wiring boards 120 each having conductors 123, wherein the board includes laminating structure sections, in each of which the multilayer resin layer 110a and the wiring board 120 are laminated at the second layer 112 side and the conductor 123 side, while the piercing conductors 113 and the conductors 123 are electrically connected. COPYRIGHT: (C)2008,JPO&INPIT