ELECTRONIC COMPONENT

ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide an electronic component which can suppress generation of whiskers in a plating layer formed on a surface of a terminal substrate by a further simplified method while adopting a lead-free material. SOLUTION: In an electronic component with a terminal 15, a terminal 11...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: SHIBATA YASUFUMI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an electronic component which can suppress generation of whiskers in a plating layer formed on a surface of a terminal substrate by a further simplified method while adopting a lead-free material. SOLUTION: In an electronic component with a terminal 15, a terminal 11 is formed by a foam metal, and its surface is coated with a plating layer 16 formed of a lead-free material. Consequently, whiskers in the plating layer 16 can be suppressed. COPYRIGHT: (C)2008,JPO&INPIT