SUBSTRATE PROCESSOR

PROBLEM TO BE SOLVED: To provide a substrate processor which detects damage of a gas supply nozzle. SOLUTION: The substrate processor is provided with: a treatment chamber 201 processing a substrate; a heating means 207 heating the substrate placed in the chamber; the gas supply nozzle 232 which ext...

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Bibliographische Detailangaben
1. Verfasser:	TAKEBAYASHI MOTONARI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate processor which detects damage of a gas supply nozzle. SOLUTION: The substrate processor is provided with: a treatment chamber 201 processing a substrate; a heating means 207 heating the substrate placed in the chamber; the gas supply nozzle 232 which extends in a prescribed direction in the chamber and supplies desired gas into the chamber; exhaust means 231 and 246 exhausting atmosphere in the chamber; wirings 1a and 1b which are installed in the gas supply nozzle 232 along the prescribed direction and can electrically be conducted; and a measuring means 1d measuring a conduction state of the wiring. COPYRIGHT: (C)2008,JPO&INPIT