FLEXIBLE PRINTED CIRCUIT BOARD

FLEXIBLE PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a flexible printed circuit board in which there is no fear of increasing transmission loss even when the flexible printed circuit board has a comparatively long length and a production cost is not increased. SOLUTION: The flexible printed circuit board 30 is composed...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: KUSAMITSU HIDEKI
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KUSAMITSU HIDEKI
description PROBLEM TO BE SOLVED: To provide a flexible printed circuit board in which there is no fear of increasing transmission loss even when the flexible printed circuit board has a comparatively long length and a production cost is not increased. SOLUTION: The flexible printed circuit board 30 is composed by containing a plurality of conductive layers 36a and 36b coated with a protective layer 38 and an insulating base material 34 forming the conductive layer 36c on one surface. The flexible printed circuit board is further composed by containing mesh cloth members 32 as meshy coating members surrounding the protective layer 38 and the whole insulating base material 34. COPYRIGHT: (C)2008,JPO&INPIT
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2008098238A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2008098238A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2008098238A3</originalsourceid><addsrcrecordid>eNrjZJBz83GN8HTycVUICPL0C3F1UXD2DHIO9QxRcPJ3DHLhYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBgYWBpYWRsYWjsZEKQIA7mAhxQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>FLEXIBLE PRINTED CIRCUIT BOARD</title><source>esp@cenet</source><creator>KUSAMITSU HIDEKI</creator><creatorcontrib>KUSAMITSU HIDEKI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a flexible printed circuit board in which there is no fear of increasing transmission loss even when the flexible printed circuit board has a comparatively long length and a production cost is not increased. SOLUTION: The flexible printed circuit board 30 is composed by containing a plurality of conductive layers 36a and 36b coated with a protective layer 38 and an insulating base material 34 forming the conductive layer 36c on one surface. The flexible printed circuit board is further composed by containing mesh cloth members 32 as meshy coating members surrounding the protective layer 38 and the whole insulating base material 34. COPYRIGHT: (C)2008,JPO&amp;INPIT</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20080424&amp;DB=EPODOC&amp;CC=JP&amp;NR=2008098238A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20080424&amp;DB=EPODOC&amp;CC=JP&amp;NR=2008098238A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUSAMITSU HIDEKI</creatorcontrib><title>FLEXIBLE PRINTED CIRCUIT BOARD</title><description>PROBLEM TO BE SOLVED: To provide a flexible printed circuit board in which there is no fear of increasing transmission loss even when the flexible printed circuit board has a comparatively long length and a production cost is not increased. SOLUTION: The flexible printed circuit board 30 is composed by containing a plurality of conductive layers 36a and 36b coated with a protective layer 38 and an insulating base material 34 forming the conductive layer 36c on one surface. The flexible printed circuit board is further composed by containing mesh cloth members 32 as meshy coating members surrounding the protective layer 38 and the whole insulating base material 34. COPYRIGHT: (C)2008,JPO&amp;INPIT</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBz83GN8HTycVUICPL0C3F1UXD2DHIO9QxRcPJ3DHLhYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBgYWBpYWRsYWjsZEKQIA7mAhxQ</recordid><startdate>20080424</startdate><enddate>20080424</enddate><creator>KUSAMITSU HIDEKI</creator><scope>EVB</scope></search><sort><creationdate>20080424</creationdate><title>FLEXIBLE PRINTED CIRCUIT BOARD</title><author>KUSAMITSU HIDEKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2008098238A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2008</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>KUSAMITSU HIDEKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUSAMITSU HIDEKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FLEXIBLE PRINTED CIRCUIT BOARD</title><date>2008-04-24</date><risdate>2008</risdate><abstract>PROBLEM TO BE SOLVED: To provide a flexible printed circuit board in which there is no fear of increasing transmission loss even when the flexible printed circuit board has a comparatively long length and a production cost is not increased. SOLUTION: The flexible printed circuit board 30 is composed by containing a plurality of conductive layers 36a and 36b coated with a protective layer 38 and an insulating base material 34 forming the conductive layer 36c on one surface. The flexible printed circuit board is further composed by containing mesh cloth members 32 as meshy coating members surrounding the protective layer 38 and the whole insulating base material 34. COPYRIGHT: (C)2008,JPO&amp;INPIT</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2008098238A
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title FLEXIBLE PRINTED CIRCUIT BOARD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T13%3A53%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KUSAMITSU%20HIDEKI&rft.date=2008-04-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2008098238A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true