FLEXIBLE PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a flexible printed circuit board in which there is no fear of increasing transmission loss even when the flexible printed circuit board has a comparatively long length and a production cost is not increased. SOLUTION: The flexible printed circuit board 30 is composed...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: KUSAMITSU HIDEKI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a flexible printed circuit board in which there is no fear of increasing transmission loss even when the flexible printed circuit board has a comparatively long length and a production cost is not increased. SOLUTION: The flexible printed circuit board 30 is composed by containing a plurality of conductive layers 36a and 36b coated with a protective layer 38 and an insulating base material 34 forming the conductive layer 36c on one surface. The flexible printed circuit board is further composed by containing mesh cloth members 32 as meshy coating members surrounding the protective layer 38 and the whole insulating base material 34. COPYRIGHT: (C)2008,JPO&INPIT