METHOD OF REMOVING TRANSPARENT FILM

PROBLEM TO BE SOLVED: To provide a method of simply removing a transparent film formed on the surface of an article or the like. SOLUTION: The method of removing a transparent film comprises: a process of covering the surface of the transparent film with an n-type semiconductor; a process of irradia...

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Bibliographische Detailangaben
Hauptverfasser:	NAGAI KEIJI, WATANABE YOSHIE, KOIKE KEIJI, GOTO HARUMITSU
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of simply removing a transparent film formed on the surface of an article or the like. SOLUTION: The method of removing a transparent film comprises: a process of covering the surface of the transparent film with an n-type semiconductor; a process of irradiating the covered n-type semiconductor with a laser; and a process of removing the transparent film by the energy of the laser absorbed in the n-type semiconductor. The conditions of the laser irradiation are that irradiation intensity (W per unit area) is 107-108W/cm2and that wavelength is 400 nm-3 μm. COPYRIGHT: (C)2008,JPO&INPIT