BUMP FORMING METHOD

PROBLEM TO BE SOLVED: To provide a method for forming a bump in which the inclination of a wafer can be detected efficiently without requiring a recognition camera with a wide field of vision exclusively for inclination detection. SOLUTION: The bumps are formed by sequentially performing a bonding operation to every adjacent IC chips 121 in a wafer 1 supplied on a bonding stage with a bonding head. Before the bonding operation, in order to obtain position data for actually bonding from preset positions of the IC chips 121, by obtaining predetermined positions 121a of IC chips 121 corresponding to one another among the adjacent IC chips 121, respectively, and by obtaining a straight line 123 which connects among the predetermined positions 121a, the inclination of the reference line of the wafer 1 to the traveling direction of the bonding operation, which is sequentially performed every adjacent IC chips 121, is detected. The method for forming a bump consists of a step of correcting the bonding position data in this manner, and a step of performing the bonding operation to the IC chips 121 based on the obtained detection result. COPYRIGHT: (C)2008,JPO&INPIT