SOLDERING METHOD

PROBLEM TO BE SOLVED: To achieve solder-packaging of a printed circuit board with the excellent soldering quality and reliability by certainly preventing land lifting at the time of using a lead-free solder. SOLUTION: The soldering method for soldering a printed circuit board having portions to be s...

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Bibliographische Detailangaben
Hauptverfasser:	SUGIURA MASAHIRO, MIZUTANI TETSUJI, TANAKA TAKASHI, TERADA HIROAKI, TANABE KAZUHIKO, IMAMURA KEIICHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To achieve solder-packaging of a printed circuit board with the excellent soldering quality and reliability by certainly preventing land lifting at the time of using a lead-free solder. SOLUTION: The soldering method for soldering a printed circuit board having portions to be soldered on both sides, comprising the steps of reflow soldering of electronic parts with a lead-free solder made of at least tin, silver and copper on one surface of the printed circuit board, and flow soldering with a tin-9 zinc solder with the part to be soldered, formed on the other surface of the printed circuit board controlled in a temperature range of 220°C to 230°C and the temperature of the soldered part by the reflow soldering maintained at 178°C or lower. COPYRIGHT: (C)2008,JPO&INPIT