BUILDUP WIRING BOARD

PROBLEM TO BE SOLVED: To provide a buildup wiring board exhibiting high heat dissipation properties by touching a metal layer of the through hole of a core layer to a metal layer of the via of a buildup layer. SOLUTION: In the buildup wiring board comprising a core substrate 4 having a via 2 formed...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAKAMURA SADASHI, ECHIGO FUMIO, SUGAWA TOSHIO, IWAZAWA AYAKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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