BUILDUP WIRING BOARD

PROBLEM TO BE SOLVED: To provide a buildup wiring board exhibiting high heat dissipation properties by touching a metal layer of the through hole of a core layer to a metal layer of the via of a buildup layer. SOLUTION: In the buildup wiring board comprising a core substrate 4 having a via 2 formed...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAMURA SADASHI, ECHIGO FUMIO, SUGAWA TOSHIO, IWAZAWA AYAKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a buildup wiring board exhibiting high heat dissipation properties by touching a metal layer of the through hole of a core layer to a metal layer of the via of a buildup layer. SOLUTION: In the buildup wiring board comprising a core substrate 4 having a via 2 formed in an insulating layer 1 and filled with conductive paste 3 for interlayer connection, and a buildup layer 5 formed at least on one side of the core substrate 4 and having a via 8 for interlayer connection, the via 2 filled with the conductive paste 3 for interlayer connection is formed in each insulating layer 1 of the core substrate 4, a through hole 6 penetrating all layers of the core substrate 4 is formed, and the via 8 formed in the buildup layer 5 and the through hole 6 are made contact through metal layers 7 and 9 formed, respectively. COPYRIGHT: (C)2008,JPO&INPIT