PATTERN-PLATING METHOD

PROBLEM TO BE SOLVED: To solve a problem in a pattern-plating method for a printed wiring board for use in various types of electronic equipment and communication equipment and the like that a plated film formed in a pattern with an ununiform pattern density in a process of a semi-additive method has ununiform thickness due to the condensation and rarefaction of the pattern density. SOLUTION: The pattern-plating method in a process of forming the wiring pattern with a plating technique comprises: arranging a wiring pattern substrate 4 having a resist pattern for plating formed thereon, on the surface of a cathode electrode 7, which faces to an anode electrode 3; fitting a mesh-shaped net 5 having an insulation sheet 6 formed in a portion corresponding to a sparse area 10 of the wiring pattern between the anode electrode 3 and the wiring pattern substrate 4 so that the mesh-shaped net 5 can cover the whole wiring pattern substrate 4; and electrolytically plating the wiring pattern substrate. COPYRIGHT: (C)2008,JPO&INPIT