PACKAGING MATERIAL

PROBLEM TO BE SOLVED: To provide a packaging material with high barrier properties, which prevents a pinhole from being caused due to heating. SOLUTION: This packaging material 10 is constituted by laminating at least an outermost layer 11 composed of polyethylene, a base material layer 12 composed...

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Bibliographische Detailangaben
Hauptverfasser: YAMATO SHOJI, YAMAGUCHI YUKINOBU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a packaging material with high barrier properties, which prevents a pinhole from being caused due to heating. SOLUTION: This packaging material 10 is constituted by laminating at least an outermost layer 11 composed of polyethylene, a base material layer 12 composed of paper, a clay coat layer 13 containing clay, an intermediate layer 14 composed of a polyethylene resin, a barrier layer 15, and an innermost layer 16 composed of low-density or medium-density polyethylene, from the side of an outer surface. Preferably, the clay coat layer 13 is formed on the base material layer 12 in such a manner as to contain at least any one of kaoline, talc, calcium carbonate and titanium dioxide. Additionally, a barrier layer 15, which is composed of at least any one of MX nylon, a vapor deposition film of a metal oxide, a vapor deposition film of a metal, and aluminum foil, is appropriately used. COPYRIGHT: (C)2008,JPO&INPIT