ULTRASOUND PROBE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To diversify functions of a frame body (mold form) surrounding a layered body which is formed by stacking a plurality of inner substrates and a plurality of backing members alternately in an ultrasound probe. SOLUTION: An oscillator assembly has a backing unit 20. The backing u...

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1. Verfasser: IWASHITA TAKAYUKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To diversify functions of a frame body (mold form) surrounding a layered body which is formed by stacking a plurality of inner substrates and a plurality of backing members alternately in an ultrasound probe. SOLUTION: An oscillator assembly has a backing unit 20. The backing unit 20 is composed of a layered body and a frame body 22 which surrounds it. The frame body 22 is composed of members exhibiting thermal conductivity and electrical conductivity. In this way, the frame body 22 exhibits functions of transferring heat and shielding at the time of the usage of the probe in addition to the function of positioning at the time of the manufacturing of the probe. Heat generated from an array vibrator 10 or the like is allowed to escape to a thermally conductive member 200 through the backing unit 20 (especially a plurality of ground layers and the frame body 22). COPYRIGHT: (C)2008,JPO&INPIT