CHIP COMPONENT AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a chip component capable of obtaining a low, stable resistance value without being affected by an increase in the resistance value due to the alloying reaction between an upper surface electrode and a conductor. SOLUTION: The chip component comprises: the pair of upper surface electrodes 12 that is formed at both the ends of the upper surface of an insulating substrate 11 and uses gold as a main constituent; a conductor 13 that is formed so that it is electrically connected to the pair of upper surface electrodes 12 and uses silver as a main constituent; a protective film 14 for covering the conductor 13; an end face electrode 15 formed on the back and end face of the insulating substrate 11 so that it is electrically connected to the upper surface electrode 12; and plated layers 17, 18 electrically connected to the pair of upper surface electrodes 12, the conductor 13, and the end face electrode 15. The conductor 13 is electrically connected to the pair of upper surface electrodes 12 so that one portion of the conductor 13 is positioned outside both the ends in the width direction of the pair of upper surface electrodes 12, and the protective film 14 covers only one portion of the conductor 13, thus exposing a part without overlapping with the pair of upper surface electrodes 12 in the conductor 13. COPYRIGHT: (C)2008,JPO&INPIT