SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To shorten a length of bonding wires, reducing a dimension of a semiconductor device in the semiconductor device constructed to have a plurality of semiconductor components in a stack. SOLUTION: A first semiconductor component is provided on a substrate for a semiconductor device which has connecting terminals provided on a top surface, and a rectangular opening is formed in a top surface of the first semiconductor component. Next, the semiconductor device is constructed, having: a rectangular second semiconductor component provided with an interposer in the opening, the interposer having first pads formed in each of adjoining regions of the four sides which define the opening in the top surface and second pads formed in the outer edge regions of the top surface making electrical connection with the first pads, and the second semiconductor component having third pads formed on each of the regions in the top surface which respectively adjoin the adjoining regions of the four sides; first wirings which electrically connect the first pads and the second pads; and second wirings which electrically connect the second pads and the connecting terminals. COPYRIGHT: (C)2008,JPO&INPIT