MULTILAYER CERAMIC SUBSTRATE, AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate excellent in mechanical strength. SOLUTION: This multilayer ceramic substrate 10 is provided with a plate-like ceramic substrate body 11, a plurality of front side terminals 21, a plurality of rear side terminals 22, an internal layer e...

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Bibliographische Detailangaben
Hauptverfasser: AKITA KAZUE, NOMURA YOSHITOSHI, NOZU KAZUYA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate excellent in mechanical strength. SOLUTION: This multilayer ceramic substrate 10 is provided with a plate-like ceramic substrate body 11, a plurality of front side terminals 21, a plurality of rear side terminals 22, an internal layer electrode 31, and a plurality energization via conductors 42 etc. The energization via conductors 42 are disposed in a plurality of via holes 41 extending in a thickness direction of the ceramic substrate body 11. The energization via conductors 42 electrically connect between the front and rear side terminals 21 and 22, between the internal layer electrode 31 and the front side terminals 21, or between the internal layer electrode 31 and rear side terminals 22. A plurality of degassing holes 61 are formed on each of spaces 43 between the energization via conductors 42. The degassing holes 61 extend in a thickness direction of the ceramic substrate body 11, and is not opened any on at least any one of front and rear surfaces 12 and 13. COPYRIGHT: (C)2008,JPO&INPIT