PRINTED-CIRCUIT BOARD
PROBLEM TO BE SOLVED: To provide a printed-circuit board capable of reducing the costs of old-model electronic equipment, when shifting to the mass production of new-model electronic equipment having a connection structure of different printed-circuit boards. SOLUTION: A plurality of rectangular lan...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a printed-circuit board capable of reducing the costs of old-model electronic equipment, when shifting to the mass production of new-model electronic equipment having a connection structure of different printed-circuit boards. SOLUTION: A plurality of rectangular lands 1c extended in the projection direction of a projection 1b are formed on one surface of the projection 1b projecting from a body section 1 in a direction vertical to the projection direction of the projection 1b. A through hole 1d penetrating the projection 1b in a thickness direction is formed in the edge of the land 1c. COPYRIGHT: (C)2008,JPO&INPIT |
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