MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of cutting a wire easily, obtaining a bump electrode in an appropriate shape, and pulling out the wire from a capillary easily. SOLUTION: The manufacturing method of a semiconductor device comprises: a process...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SHINKAWA HIDEYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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