MACHINING BOARD, ITS MANUFACTURING METHOD, DIE FOR MACHINING MOTHER BOARD, AND MANUFACTURING METHOD OF PRODUCT BOARD

PROBLEM TO BE SOLVED: To provide a machining board capable of stably carrying a product board on a frame while the product board is hard to come off, its manufacturing method, a die for machining a mother board, and a manufacturing method of the product board. SOLUTION: The machining board includes...

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1. Verfasser: IWAMOTO KATSUHIKO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a machining board capable of stably carrying a product board on a frame while the product board is hard to come off, its manufacturing method, a die for machining a mother board, and a manufacturing method of the product board. SOLUTION: The machining board includes a frame 14, printed circuit boards 12a-12c temporarily fixed to the frame 14 via at least one of its sides, supporting boards 16a-16c serving as mother boards including the frame 14 and punched from a region adjacent to the printed wiring boards 12a-12c and fitted into their original holes, and recessed grooves 18a-18c formed along borders between the frame 14 and the printed circuit boards 12a-12c or their vicinity. At least one of tips of the supporting boards 16a-16c is inside the recessed grooves 18a-18c, and the inside of the adjacent region is punched from the tips of the supporting boards 16a-16c to the recessed grooves 18a-18c. Further, its manufacturing method, the die for machining the mother board, and the manufacturing method of the product board are also disclosed. COPYRIGHT: (C)2008,JPO&INPIT