THERMOSETTING FILMY ADHESIVE COMPOSITION, AND THERMOSETTING FILMY ADHESIVE TAPE

PROBLEM TO BE SOLVED: To provide a thermosetting filmy adhesive composition which is excellent in adhesion and thermal resistance, can form a sealing composition capable of being packed into fine clearances and does not form a cured product running off the edges of resin films. SOLUTION: The thermos...

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Bibliographische Detailangaben
1. Verfasser:	NISHINO YUKINORI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a thermosetting filmy adhesive composition which is excellent in adhesion and thermal resistance, can form a sealing composition capable of being packed into fine clearances and does not form a cured product running off the edges of resin films. SOLUTION: The thermosetting-type filmy adhesive composition used is the film which is formed by dissolving a resin composition comprising (A) a nitrile/butadiene rubber, (B) a phenol resin, (C) a polyamide resin and (D) a plasticizer in (E) an organic solvent, and thereafter, removing the organic solvent to a concentration of practically no remnant, to form a film having a thickness of 10-100 μm. COPYRIGHT: (C)2008,JPO&INPIT